Navigation

×

The process is to melt polycrystalline materials such as polysilicon with graphite heater in an inert gas (nitrogen, helium) environment, and grow single crystals without dislocation by czochralase method.

Applicable products: dry screw vacuum pump, slide valve vacuum pump, diffusion pump, rotary vane vacuum pump, Roots vacuum unit and other pumps.

The process gas is mixed with electrolyte, and there may be a trace amount of LPF6 (lithium hexafluorophosphate), which requires the vacuum pump to have a certain anti-solvent and anti-corrosion ability.

Applicable products: Roots vacuum unit, dry screw vacuum pump, rotary vane vacuum pump, liquid ring vacuum pump and other pumps.

The process gas may be mixed with positive material powder, positive solvent and negative material powder, negative solvent, requiring the vacuum pump to have a certain resistance to dust, water vapor and other solvents (NMP).

Applicable products: Roots vacuum unit, dry screw vacuum pump, rotary vane vacuum pump and other pumps.

The process gas may be mixed with positive and negative electrode material powder (pole sheet drying), water vapor (cell and pole sheet drying) requires that the vacuum pump has a certain resistance to dust and water vapor.

Applicable products: Roots vacuum unit, dry screw vacuum pump, rotary vane vacuum pump and other pumps.

The process gas may be mixed with positive material powder, positive solvent and negative material powder, negative solvent, requiring the vacuum pump to have a certain resistance to dust, water vapor and other solvents (NMP).

Applicable products: Roots vacuum unit, dry screw vacuum pump, rotary vane vacuum pump and other pumps.

The process is mainly divided into three types of vacuum evaporation coating, vacuum sputtering coating and vacuum ion coating, through physical methods to deposit the substrate surface of the material source to form a film with special functions.

Applicable products: Roots vacuum unit, dry screw vacuum pump, rotary vane vacuum pump, molecular pump and other pumps.

This process is a material surface modification technology, the atoms of a certain element are ionized into ions, and finally stay in the material, so that a series of physical and chemical interactions occur, so as to obtain excellent surface properties.

Applicable products: Roots vacuum unit, dry screw vacuum pump, rotary vane vacuum pump, molecular pump and other pumps.

Wafer cleaning process is one of the most important process links in IC manufacturing, its main role is to remove impurities and attachments on the wafer, to ensure the purity and yield of the wafer.

Applicable products: Roots vacuum unit, dry screw vacuum pump, rotary vane vacuum pump, molecular pump and other pumps.